SSF2N60F ? silikron semiconductor co.,ltd. 20 1 2 . 08 . 18 version : 1. 1 page 1 of 8 www.silikron.com main product characteristics: features and benefits : description : absolute max rating : symbol parameter max. units i d @ tc = 25c continuous drain current, v gs @ 10v 2 a i d @ tc = 100c continuous drain current, v gs @ 10v 1.3 i dm pulsed drain current 8 p d @tc = 25c power dissipation 23 w linear derating factor 0.18 w/c v ds drain - source voltage 600 v v gs gate - to - source voltage 30 v e as single pulse avalanche energy @ l= 55 mh 110 mj i a s avalanche current @ l= 55 mh 2 a t j t stg operating junction and storage temperature range - 55 to + 150 c v dss 600 v r ds (on) 3.6 ohm (typ . ) i d 2 a to220f marking and pin assignment schematic diagram ? advanced mosfet process technology ? special designed for pwm, load switching and general purpose applications ? u ltra low on - resistance with low gate charge ? f ast switching and reverse body recovery ? 150 operating temperature it utilizes the latest processing techniques to ach ieve the high cell density and reduces the on - resistance with high repetitive avalanche rating . these features combine to make this design an extremely efficient and reliable device for use in power switching application and a wide variety of other applications .
ssf 2n60f ? silikron semiconductor co.,ltd . 20 1 2 . 08 . 18 version : 1. 1 page 2 of 8 www.silikron.com thermal resistance symbol characterizes typ. max. units r jc junction - to - case 5.5 /w r j a junction - to - ambient ( t 10s ) 62 /w junction - to - ambient (pcb mounted, steady - state) 40 /w electrical characterizes @t a =25 unless otherwise specified symbol parameter min. typ. max . units conditions v ( b r) dss drain - to - source breakdown voltage 600 v v gs = 0v, id = 250a r ds(on) static drain - to - source on - resistance 3.6 4 v gs =10v , i d = 1 a 8.01 t j = 1 25 v gs(th) gate threshold voltage 2 4 v v ds = v gs , i d = 250a 2. 17 t j = 1 25 i dss drain - to - source leakage current 1 a v ds = 600 v,v gs = 0v 50 t j = 125 i gss gate - to - source forward leakage 1 00 na v gs = 30 v - 1 00 v gs = - 30 v q g total gate charge 11.5 nc i d = 2 a , v ds = 480 v , v gs = 10v q gs gate - to - source charge 2.7 q gd gate - to - drain("miller") charge 4.5 t d(on) turn - on delay time 9.4 ns v gs =10v, vds= 300 v, r l = 150 , r gen = 25 id= 2 a t r rise time 7.4 t d(off) turn - off delay time 25.4 t f fall time 20.8 c iss input capacitance 323 pf v gs = 0v v ds = 25 v ? = 1m hz c oss output capacitance 40 c rss reverse transfer capacitance 5 source - drain ratings and characteristics symbol parameter min. typ. max . units conditions i s continuous source current (body diode) 2 a mosfet symbol showing the integral reverse p - n junction diode. i sm pulsed source current ( body diode ) 8 a v sd diode forward voltage 0.86 1 .3 v i s = 2 a, v gs =0v t rr reverse recovery time 259.3 ns t j = 25c , i f = 2 a, di/dt = 10 0a/s q rr reverse recovery charge 1419 nc
ssf 2n60f ? silikron semiconductor co.,ltd . 20 1 2 . 08 . 18 version : 1. 1 page 3 of 8 www.silikron.com test circuits and waveforms switch waveforms: n otes : the maximum current rating is limited by bond - wires. repetitive rating; pulse width limited by max. junction temperature. the power dissipation pd is based on max. junction temperature , using junc tion - to - case thermal resistance . the value of r j a is measured with the device mounted on 1in 2 fr - 4 board with 2oz. copper, in a still air environment with ta =25c
ssf 2n60f ? silikron semiconductor co.,ltd . 20 1 2 . 08 . 18 version : 1. 1 page 4 of 8 www.silikron.com t ypical electrical and thermal characteristics fig ure 2. g ate to source cut - off voltage figure 1: typical output characteristics fig ure 3. drain - to - source breakdown voltage vs. temperature figure 4: normalized on - resistance vs. case temperature
ssf 2n60f ? silikron semiconductor co.,ltd . 20 1 2 . 08 . 18 version : 1. 1 page 5 of 8 www.silikron.com fig ure 5 . maximum drain current vs. case temperature case temperature t ypical electrical and thermal characteristics fig ure 6 .typical capacitance vs. drain - to - source voltage fig ure 7 . maximum effective transient thermal impedance, junction - to - case
ssf 2n60f ? silikron semiconductor co.,ltd . 20 1 2 . 08 . 18 version : 1. 1 page 6 of 8 www.silikron.com mechanical data min nom max min nom max e 9.960 10.160 10.360 0.392 0.400 0.408 e1 9.840 10.040 10.240 0.387 0.395 0.403 e2 6.800 7.000 7.200 0.268 0.276 0.283 a 4.600 4.700 4.800 0.181 0.185 0.189 a1 2.440 2.540 2.640 0.096 0.100 0.104 a2 2.660 2.760 2.860 0.105 0.109 0.113 a3 0.600 0.700 0.800 0.024 0.028 0.031 c - 0.500 - - 0.020 - d 15.780 15.870 15.980 0.621 0.625 0.629 d1 8.970 9.170 9.370 0.353 0.361 0.369 h1 6.500 6.700 6.800 0.256 0.264 0.268 e p 3.080 3.180 3.280 0.121 0.125 0.129 p 1 1.400 1.500 1.600 0.055 0.059 0.063 p 2 0.900 1.000 1.100 0.035 0.039 0.043 p 3 0.100 0.200 0.300 0.004 0.008 0.012 l 12.780 12.980 13.180 0.503 0.511 0.519 l1 2.970 3.170 3.370 0.117 0.125 0.133 l2 0.830 0.930 1.030 0.033 0.037 0.041 q1 3 o 5 o 7 o 3 o 5 o 7 o q2 43 o 45 o 47 o 43 o 45 o 47 o b1 1.180 1.280 1.380 0.046 0.050 0.054 b2 0.760 0.800 0.840 0.030 0.031 0.033 b3 - - 1.420 - - 0.056 symbol dimension in millimeters dimension in inches 2.54bsc 0.10bsc to220f package outline dimension_gn
ssf 2n60f ? silikron semiconductor co.,ltd . 20 1 2 . 08 . 18 version : 1. 1 page 7 of 8 www.silikron.com ordering and marking information device marking: ssf 2n60f package (available) to 220 f operating temperature range c : - 55 to 150 oc devices per unit package type units/ tube tubes/inner box units/inner box inner boxes/carton box units/carton box to 220 f 50 20 1000 6 6000 reliability test program test item conditions duration sample size high temperature reverse bias(htrb) t j =125 to 1 5 0 @ 80% of max v dss /v ces /vr 168 hours 500 hours 1000 hours 3 lots x 77 devices high temperature gate bias(htgb) t j =150 @ 100% of max v gss 168 hours 500 hours 1000 hours 3 lots x 77 devices
ssf 2n60f ? silikron semiconductor co.,ltd . 20 1 2 . 08 . 18 version : 1. 1 page 8 of 8 www.silikron.com attention: any and all silikron products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life - support systems, aircraft's control systems, or other ap plications whose failure can be reasonab ly exp ected to result in serious physical and/or material damage. consult with your silikron representative nearest you before using any silikron products described or contained herein in such applications. silikron assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specifications of any and all silikron products described or contained herein. specifications of any and all silikron products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are no t guarantees of the performance, characteristics, and functions of the described products as mounted in the customers products or equipment. to verify s ymptoms and states that cannot be evaluated in an independent device, th e customer should always evalu ate and test devices mounted in the customers products or equipment. silikron semiconductor co.,ltd. strives to supply high - quality high - reliability products. however, any and all semiconductor products fail with some probability. it is possible that these probabilistic failures could give rise to accident s or events that could endanger human lives, that could give rise to smoke or fire, or that could cause damage to other property. when designing equipment, adopt safety measures so that these kinds o f accidents or events cannot occur. such measures include but are not limited to protective circuits and error prevention circuits for safe design, redundant design, and structural design. in the event that any or all silikron products(including techni cal data, services) described or contained herein are controlled under any of applicable local export control laws and regulations, such products must not be exported without obtaining the export license from the authorities concerned in accordance with th e above law. no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior writt en permission of silikron semiconductor co.,ltd. information (including circuit diagrams and circuit parameters) herein is for example only ; it is not guaranteed for volume production. silikron believes information herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringements of intellectual property rights or other rights of third parties. any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc. when designing equipment, refer to the "delivery specification" for the silikron product that you intend to use. this catalog provides information as of dec, 2008. specifications and information herein are subject t o change without notice. customer service worldwide sales and service : sales@ silikron .com technical support: technical@ silikron .com suzhou silikron semiconductor corp. 11a, 4 2 8 xinglong street, suzhou industrial park, p.r.china tel: (86 - 512 ) 62560688 fax: (86 - 512) 65160705 e - mail: sales@ silikron .com
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